Euro-me collaborates with NEXENSOR & MSG to participate in the 2025 CIOE
Source : Euro-me Shenzhen Trade & Development Co., Ltd. Time : 2025-09-05 Hits : 4
2025 marks the 30th anniversary of the establishment of Euo-me Company.As the general agent of NEXENSOR and MSG in the China region, Euro-me will participate together with the two companies in CIOE2025 held at the Shenzhen International Expo Center from September 10-12, 2025.
The 26th China International Optoelectronics Expo (CIOE) will be held from September 10-12, 2025 at the Shenzhen International Convention and Exhibition Center. As a comprehensive exhibition covering the entire optoelectronic industry chain, CIOE China Optoelectronics Expo brings together over 3800 high-quality exhibitors from more than 30 countries and regions around the world. The eight themed exhibitions cover information communication, precision optics, camera technology and applications, laser and intelligent manufacturing, infrared, ultraviolet, intelligent sensing, new displays AR & VR、 The Optoelectronic Innovation and other sectors are a one-stop efficient procurement platform for finding materials, components, equipment, and solutions needed in research and development and manufacturing. They are also a precise business matching platform for meeting business needs, rapidly expanding business social circles, and grasping the forefront information and dynamics of industry development.
Our booth number is 3A20-1.
At this exhibition, we will showcase the latest testing technology applied by South Korean company Naishen in the semiconductor and display industry
1. High speed line scanning white light triangulation sensor for detecting BGA and BUMP.
2. Provide a comprehensive 3D optical measurement solution for the advanced semiconductor packaging industry.
3. White light interferometric scanning sensor - measurement speed only takes 1 second, Z-direction repeatability accuracy of 10nm, can be integrated into equipment for batch detection.
4. Interference based thickness/displacement sensor - using near-infrared interferometry, a single probe can measure thickness/displacement, suitable for applications such as wafer thickness measurement.
We look forward to many new and old customers and friends visiting our booth, providing guidance, and exploring cooperation!
Exhibiting products:
3D Free form Measure System 3D Scanning Interferometer Microscope
Interference based thickness/displacement sensor white light triangulation sensor
In addition, our company will also exhibit the German MSG autofocus sensor. The German MSG autofocus sensor is applied in defect detection of panels, glass, and other materials, suitable for various products such as TFT-LCD, OLED, Micro/MiniLED, etc.
Welcome new and old friends to visit and negotiate at our booth!
If you are interested in Nexensor and MSG related products and solutions, please contact:
Martin@euro-me.com Tel:0755-83842035 13632890602