As a comprehensive exhibition covering the entire optoelectronic industry chain, CIOE China Optical Fair gathers over 4,000 high-quality exhibitors from more than 30 countries and regions worldwide. Its eight themed exhibitions span sectors such as information and communication, precision optics, camera technology and applications, laser and smart manufacturing, infrared, ultraviolet, intelligent sensing, new display technologies, AR & VR, and optoelectronic innovation.
The exhibition will be held concurrently with the IICIE International Integrated Circuit Innovation Exhibition (IC Innovation Exhibition) and the 23rd Shenzhen International Electronic Exhibition & Embedded Systems Exhibition at the Shenzhen World Exhibition & Convention Center (Bao´an). With a scale of 320,000 square meters, it is expected to gather over 5,000 exhibitors and attract more than 240,000 professional visitors. Together, they will create an international high-end platform integrating technology showcases, industry exchanges, and business collaboration, injecting strong innovative momentum into key fields such as optoelectronics, integrated circuits, electronics, and embedded systems.

Our booth number is 3E11.

At this exhibition, we will showcase the latest inspection technology developed by Korea´s Naisun Company for advanced semiconductor packaging and hybrid bonding processes
1. nxNano Advanced Packaging Integrated Optical Measurement Equipment - Used for measuring Chip Topography, RDL, CD, Microbump, etc.
2. nxMacro Wafer Warpage Measurement Equipment - Capable of measuring warpage on both the front and back surfaces of wafer without or with patterns, supporting up to 6mm warpage.
3. nxChip Wafer Warpage Measurement Equipment - Ultra-high-speed inspection of wafer warpage, capable of integrating multiple measurement technologies to cover ranges from a few micrometers to hundreds of micrometers.
4. White light interference scanning sensor - Measurement speed is only 1 second, with a Z-axis repeatability of 10nm, and can be integrated into equipment for batch inspection.
5. Interferometry Thickness/Displacement Sensor - Utilizes near-infrared interferometry, enabling single-probe measurement of thickness/displacement, suitable for applications such as wafer thickness measurement.
We look forward to welcoming numerous new and existing clients, as well as friends, to our booth for guidance and collaboration discussions!